首页> 外文会议>International Conference on Processing Materials for Properties >LAMINATION INTERFACE OF THE WAXLESS PERMANENT CATHODE PROCESS IN COPPER REFINERY
【24h】

LAMINATION INTERFACE OF THE WAXLESS PERMANENT CATHODE PROCESS IN COPPER REFINERY

机译:铜炼油厂瓦最快永久性阴极工艺的层压界面

获取原文

摘要

The lamination interface generated by a power outage during the electrorefining of copper using a waxless permanent-cathode was investigated to elucidate the formation mechanism of the interface. X-ray diffraction and X-ray photoelectron spectroscopic measurements revealed that the interface is composed mostly of CuCl(s). Based on the thermodynamics of aqueous solution containing copper ions and chloride anions, it is considered that Cu~+ ions are spontaneously generated through the reaction Cu + Cu~(2+)→2Cu~+ at the surface of the copper cathode, resulting in the deposition of insoluble CuCl(s). Circulation of electrolyte during the power outage could suppress the accumulation of Cu~+ ions in the vicinity of the cathode and minimize the formation of CuCl(s) layer, which makes the lamination interface after recovery from the power outage.
机译:研究了使用遍布永久性阴极的铜电铜电流期间产生的叠层界面,以阐明界面的形成机制。 X射线衍射和X射线光电子体光谱测量显示,界面主要由CuCl(S)组成。基于含铜离子和氯离子的水溶液的热力学,认为Cu〜+离子通过铜阴极表面的反应Cu + Cu〜(2+)→2cu〜+自发地产生。不溶性CuCl的沉积。电解质在停电期间的循环可以抑制阴极附近Cu〜+离子的积聚,并最大限度地减少CuCl(S)层的形成,这使得从断电后恢复后的层压界面。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号