Influence of different deposition parameters on the performance of a Ti-Ta-C interface layer in SiC-fiber reinforced copper matrix composites

摘要

The mechanical properties of a SiC-fiber/copper matrix composite, reinforced with SCS- 0 SiC-fibers (Φ 140μm, Specialty Materials), can significantly be increased by applying a Ti-Ta-C multilayer between fiber and matrix. This interlayer is deposited with a magnetron sputter device directly on the single fibers. By changing the deposition parameters of this sputter process the Ti- Ta-C interlayer can be optimized regarding fiber strength and fiber/matrix adhesion. Experiments with different deposition pressures, bias voltages and layer thickness' were performed to increase the bond strength and the ultimate tensile strength when compared to the Ti-Ta-C reference sample.