Polyimide (PI) removal caused the present Electrostatic Discharge (ESD) resistivity specified limit of water to induce electrostatic arcing. The small amount of charge accumulated in the passivation layer jumps in the form of mini electrical arc to device metal layers causing dielectric breakdown and resulting to an Electrical Overstress (EOS) like damage. This paper aims to show how an electrical arcing discharge happened during wafer saw and wash process and how it was aided.
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