Next-generation materials and device structures: one-dimensional quantum-wires, nano-dots, electron-energy filtering, vacuum/hetero-structure thermionics, reversible solid-state thermodynamics towards achieving Carnot limit employing III-V, IV-IV, II-VI, V-VI hetero-structures. Next-generation integration: on to multifunctional SOCs, wafer-scale processing. Advantage over conventional thermoelectrics - >100 smaller size - >1000 power density or cooling density - >1000 faster response. Dramatically reduce materials usage, by 1/20,000th, for significantly better efficiency and functionality. Energy harvesting for bio-implants, sensors, wireless communication devices, actuators, etc. Synergy with electronic thermal management or chip cooling can accelerate technology and lower cost.
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