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Formation of grooves in SiO_2 coated silicon using femtosecond Ytterbium DPSS laser

机译:使用Femtosecond YTTerbium DPSS激光器在SiO_2涂层硅中形成凹槽

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摘要

Femtosecond laser micromachining of grooves in the SiO_2 coated crystal silicon is investigated using 300 fs laser pulses at a center wavelength of 1030 nm. A novel chirped pulse amplified femtosecond Yb:KGW laser source (Pharos, Light Conversion, Lithuania) with high pulse repetition rate of 1- 350 kHz and high average power up to 8 W is employed. The ablation depth of grooves as a function of pulse repetition rate, number of passes over the same groove, and the light polarization relative to the cutting direction is investigated. Different scanning algorithms as well as influence of the focal plane height relative to the sample are investigated.
机译:使用300 fs激光脉冲在1030nm的中心波长下研究SiO_2涂覆的晶体硅中的凹槽的飞秒激光微机械。一种新型啁啾脉冲放大飞秒YB:采用高脉冲重复率的KGW激光源(Pharos,光转换,立陶宛),高达8W的高脉冲重复率高达8W。研究了作为脉冲重复率的函数的凹槽的消融深度,相同凹槽上的通过的次数,以及相对于切割方向的光偏振。研究了不同的扫描算法以及相对于样品的焦平面高度的影响。

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