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THE EFFECT OF MOLD TEMPERATURE ON EXUDATION IN HEATED MOLD CONTINUOUS CASTING Cu-15Ni-8Sn ALLOY

机译:模具温度对加热模具连续铸造Cu-15%Ni-8%Sn合金渗出的影响

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An exudation layer was observed in Cu-15%Ni-8%Sn alloy prepared by heated mold continuous casting (HMCC). The effect of mold temperature on thickness of exudation layer was discussed. The results show that exudation layer mainly composed by (Cu, Ni)17Sn3. While the mold temperature increases, the thickness of exudation layer is increases. The gap is formed between the mold wall and the edge of solidified alloy in higher mold temperature. The liquid enriches Sn solute, which is caused by solute redistribution, into the gap, and freezes at the last stage of HMCC Cu-15%Ni-8%Sn process to form exudation layer.
机译:在Cu-15%Ni-8%Sn合金中观察到通过加热的模具连续铸造(HMCC)制备的渗出层。讨论了模具温度对渗出层厚度的影响。结果表明,主要由(Cu,Ni)17Sn3组成的渗出层。虽然模具温度升高,但渗出层的厚度增加。在较高模具温度下,在模具壁和凝固合金的边缘之间形成间隙。液体富集Sn溶质,该Sn溶质是由溶质再分配到HMCC Cu-15%Ni-8%Sn加工的最后阶段的间隙中引起的,以形成渗出层。

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