FABRICATION AND CHARACTERIZATION OF SiO{sub}x/PARYLENE AND SiN{sub}x/PARYLENE THIN FILM ENCAPSULATION LAYERS

摘要

Successful commercialization of flexible organic electronic devices is largely dependent on proper encapsulation that protects them from permeation of oxygen and water vapor. At present, low permeation encapsulation materials generally consist of multilayer films of organic/inorganic materials which can be deposited by plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), and vapor phase deposition. For this study, we report the effective water vapor transmission rates (WVTR) for multilayer thin films consisting of low temperature PECVD deposited SiN{sub}x and SiO{sub}x combined with a parylene organic layer. The effective WVTR was measured as a function of the number of bilayer pairs using Ca corrosion tests. The effective WVTR at 20°C and 50% relative humidity [RH] for three bilayer pairs of SiO{sub}x/parylene ranged between 4.4-8.0×10{sup}(-4) g/m{sup}2/day while SiN{sub}x/parylene had a transmission rate 1.3×10{sup}(-4) g/m{sup}2/day. In general, additional layers were found to decrease the permeation rates to as low as 3.9×10{sup}(-5)g/m{sup}2/day, while the SiN{sub}x/parylene coatings performed the best overall.