Study on Mechanism for Chip Removal by Molecular Dynamics Simulation in Ultra-High Speed Grinding

摘要

In this paper the physics models and mathematics models of molecular dynamics simulation in ultra high speed grinding are built up. The models are consisted of the boundary atom, Newton's atom and the constant temperature atom. The interaction between the grinding grain particles and workpiece particles is computed by the Tersoff empirical potential function. The equation of motion is built up. It is solved by numerical value and the speed and displacement of these particles are obtained. Finally the motion track of them in the different depth of cutting is simulated. According to the variety regulation of surface and the variety circumstance of the removal particles, the reasonable explanation about the mechanism for chip removal of ultra high speed grinding is given.