Three-Dimensional Chip-Scale Optical Interconnects and Switches with Self-Organized Wiring Based on Device-Embedded Waveguide Films and Molecular Nanotechnologies

摘要

We review our strategy toward chip-scale optical interconnect/switching with nano-scale packaging. A three-dimensional optoelectronic (3-D OE) platform "System in S-FOLM" consisting of stacked OE films with embedded thin-film devices provides multilayer OE boards, 3-D stacked OE LSIs, 3-D optical switching systems, and so on. OE Amplifier/Driver-Less Substrate (OE-ADLES), where E-O and O-E conversions are respectively carried out by light modulators directly-driven by LSI output and by photodetectors directly-generating LSI input, reduces power dissipation and increases data rate in the platform. To realize the 3-D OE platform, waveguide films with surface-normal mirrors, resource-saving heterogeneous integration, 3-D optical wiring, and nano optical ICs and their mass production processes are required. These will be achieved our five original core technologies: the built-in mask method, PL-Pack with SORT, SOLNET, the molecular-controlled growth, and MND. The FDTD simulation reveals that in nano optical ICs of photonic crystals ～ 0.6-ps delay arises to complete lightwave interferences and confine lightwaves into waveguide regions. In addition, the molecular-controlled growth may enable future molecular transistor circuits.