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A Micromachined Robust Planar Triggered Sparkgap Switch for High Power Pulse Applications

机译:用于高功率脉冲应用的微机械型鲁棒平面触发的SparkGAP开关

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High voltage switches capable of operating at high speeds over a wide range of voltages and energies are used in a variety of applications in material science and plasma physics. Fast rising, low impedance electrical discharges from a capacitor system have applications ranging from transient testing of digital transmission lines to initiation of single and multi-point detonators in various ordnance systems. Of particular interest is the use of smaller scale capacitor discharges in single point, in-line fuzing systems such as those using slapper detonators. Semiconductor switches have been previously considered for such applications. However, the cost associated with such devices may be prohibitive in some high volume ordnance systems. Recent development of lower voltage, low cost slapper detonators has resulted in slappers being reconsidered for some comparatively inexpensive in-line systems. The design, fabrication and characterization of a monolithic high voltage switch is discussed which could be used with low voltage slapper detonators. The structure consists of a planar electrode arrangement that is capable of standing off a potential in excess of 1000V. The structure can be electrically or optically triggered. The device is capable of switching high transient currents. The device can be integrally packaged with a stripline geometry in order to reduce interconnect parasitic impedances to a minimum. The utilization of standard microelectronic fabrication techniques will be emphasized in the design. This will allow for economic manufacturing in large volumes.
机译:能够在各种电压和能量上以高速操作的高压开关用于材料科学和等离子体物理的各种应用中。快速上升,来自电容器系统的低阻抗电放电具有从数字传输线的瞬态测试到各种刚性系统中的单点和多点雷管启动的应用。特别令人兴趣的是在单点中使用较小的刻度电容器,在线福音系统,例如使用壁板雷管的系统。先前已考虑过半导体开关用于此类应用。然而,与这种设备相关联的成本在一些大容量官僚系统中可能是禁止的。最近的较低电压的开发,低成本的滑动戒断器导致了用于一些相对便宜的在线系统的重新考虑的弹力。讨论了整体高压开关的设计,制造和表征,可以与低压扣机雷管释放器一起使用。该结构包括平面电极装置,其能够远离超过1000V的电位。结构可以电或光学触发。该设备能够切换高瞬态电流。该装置可以用带状线几何整体包装,以将互连寄生阻抗减少到最小。在设计中强调了标准微电子制造技术的利用。这将允许大量经济制造。

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