In perpendicular recording, the soft under-layer film (henceforth SUL) is an essential layer for enhancing the recording field. The SUL is usually of 100nm thickness or more, which is too thick to deposit by sputtering. Therefore, one of the recent development works involving SUL focused on reducing its thickness. Conversely, thick SUL films using a plating method were reported, involving a wet process, which made it easy to obtain thick films over 1000nm. In this paper, anisotropic CoFeNiB SUL films made by an electro-less plating process are investigated and various factors affecting the anisotropy are reported.
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