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CCD Development Progress at Lawrence Berkeley National Laboratory

机译:劳伦斯伯克利国家实验室的CCD发展进展

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P - channel CCD imagers, 200 - 300 μm thick, fully depleted, and back-illuminated are being developed for scientific applications including ground - and space - based astronomy and x - ray detection. These thick devices have extended IR response, good Point-Spread Function (PSF) and excellent radiation tolerance. Initially, these CCDs were made in-house at LBNL using 100 mm diameter wafers. Fabrication on high-resistivity 150 mm wafers is now proceeding according to a model in which the wafers are first processed at DALSA Semiconductor up to the Al contact mask step. They are then thinned and the remaining processing is done in small batches at LBNL. Alternative approaches are also discussed. In addition we have implemented designs that permit high - voltage biasing to further improve the PSF. With these designs, operation of 200 μm thick CCDs at 100 V or more bias with excellent PSF is practical.
机译:P - 通道CCD成像仪,200 - 300μm厚,完全耗尽,并为科学应用开发,包括地面和空间天文学和X射线检测。这些厚设备具有延长的IR响应,良好的点扩展功能(PSF)和出色的辐射耐受性。最初,这些CCD在使用100mm直径的晶片的LBNL下在房屋内进行。现在根据高电阻率150mm晶片的制造根据其中在Dalsa半导体在Dalsa半导体上首先加工到Al接触掩模步骤的模型。然后,它们变薄,并且剩余的处理是在LBNL的小批次中进行的。还讨论了替代方法。此外,我们已经实现了允许高压偏置以进一步改善PSF的设计。利用这些设计,200V或更多偏压的200μm厚的CCD的操作实用。

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