首页> 外文会议>the Pacific Rim Conference on Ceramic and Glass Technology >THERMOELECTRIC PROPERTIES OF beta-TYPE Bi_(0.5)Sb_(0.5)Te3 COMPOUNDS PREPARED BY SPARK PLASMA SINTERING METHOD
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THERMOELECTRIC PROPERTIES OF beta-TYPE Bi_(0.5)Sb_(0.5)Te3 COMPOUNDS PREPARED BY SPARK PLASMA SINTERING METHOD

机译:通过火花等离子体烧结方法制备的β型Bi_(0.5)Sb_(0.5)Sb_(0.5)TE3化合物的热电性能

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Thermoelectric properties of the 4wt% Te doped p-type Bi_(0.5)Sb_(1.5)Te3 compounds fabricated by using spark plasma sintering in the temperature ranging from 250°C to 350°C.The microstructure and thermoelectrical properties of specimens were characterized.The density of the sintered compounds was increased to 99.2% of theoretical density by carrying out the consolidation at 350°C for 2 min.The Seebeck coefficient,thermal conductivity and electrical resistivity were dependent on hydrogen reduction process and sintering temperature.It was observed that the Seebeck coefficient increased with reduction process while the electrical resisitivity significantly decreased.Also,the electrical resistivity decreased and thermal conductivity increased with sintering temperature.The results suggest that the carrier density and mobility vary with reduction process and sintering temperature.The highest figure of merit of 3.5X10~(-3)/K was obtained for the compounds spark plasma sintered at 350°C for 2 min by using the hydrogen-reduced powders.
机译:通过在250℃至350℃的温度范围内使用火花等离子体烧结制造的4wt%TE掺杂P型Bi_(0.5)Sb_(1.5)Sb_(1.5)TE3化合物的热电性能。表征样品的微观结构和热电性能。通过在350℃下在350℃下进行合并2分钟,将烧结化合物的密度增加到理论密度的99.2%。塞内克系数,导热性和电阻率取决于氢还原过程和烧结温度。观察到这一点塞贝克系数随着还原过程的增加而增加,而电阻显着降低。ALSO,电阻率降低,导热率随烧结温度而增加。结果表明载流子密度和迁移率随着还原过程和烧结温度而变化。获得350℃的化合物火花等离子体的3.5x10〜(-3)/ k使用氢还原粉末2分钟。

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