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Microstructure and Thermoelectric Properties of Rapidly Solidified and Hot Pressed N-Type 95Bi_2Te_3-5Bi_2Se_3 Alloys

机译:快速固化和热压N型型95%Bi_2Te_3-5%Bi_2Se_3合金的微结构和热电性能

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N-type 0.05wt% SbI_3-doped Bi_2Te_(2.85)Se_(0.15) compounds were fabricated by gas atomizing and hot pressing. The as-fabricated powder consists of homogeneous Bi_2Te_3+Bi_2Se_3 solid solution and a maximum theoretical density of 98.9% was obtained after hot pressing, resulting in improvement of compression strength up to 4-5 times of the conventionally prepared single crystal thermoelectric material. The values of the Seebeck coefficient for hot pressed specimens vertical of the pressing direction with small and large powder size were -178 and -218μV/K, respectively. The values of the electrical resistivity for hot pressed specimens vertical of the pressing direction with small and large powder with small and large powder size were 1.245 and 1.728 × 10~(-5) Ω m, respectively.
机译:通过气体雾化和热压制造N型0.05wt%Sbi_3掺杂的Bi_2Te_(2.85)Se_(0.15)化合物。由制造的粉末由均相Bi_2Te_3 + Bi_2Se_3固体溶液组成,在热压后获得的最大理论密度为98.9%,导致常规制备的单晶热电材料的压缩强度高达4-5倍的压缩强度。具有小和大粉末尺寸小和大粉末尺寸的热压样本垂直的塞贝克系数的值分别为-178和-218μV/ k。具有小且大的粉末尺寸小粉末的热压样品的电阻率的值分别为小粉末,粉末大小,分别为1.245和1.728×10〜(-5)Ωm。

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