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Composite Contacts in Microsystems: Fabrication of Metal-Nanostructured Titania Nanocomposites

机译:微系统中的复合触点:金属 - 纳米结构二氧化钛纳米复合材料的制造

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Integrated micrometer scale interpenetrating Au-Nanostructured vTiO2 (NST) network nanocomposites have been fabricated using a two step process. Fifst^NST pad arrays were prepared by reacting Ti surfaces, patterned with an SiO2 masking layer, with aqueous H2O2. NST formed is porous with pores 50 to 200 nm in diametet,and walls about 75 to 125 nm thick. Second, Au was infiltrated into pores of NST using electroless deposition to form the nanocomposite. SEM studies indicate that Au was deposited into pores of NST with little void formation. Selective deposition of Au on NST pads was confirmed using XRD and area-mode XPS. This process is a general route to forming micrometer-scale nanocomposite features consisting of NST and metals that are amenable to electroless deposition.
机译:通过两个步骤方法制造了集成的千分尺刻度互穿Au-纳米结构的VTIO2(NST)网络纳米复合材料。通过使Ti表面与SiO 2掩模层图案化,用H 2 O 2水溶液使Ti表面反应制备第五^ NST阵列。形成的NST在径向孔50至200nm中是多孔的,壁约75至125nm厚。其次,使用无电沉积将Au渗透到NST的孔中以形成纳米复合材料。 SEM研究表明,Au沉积到NST的孔中,几乎没有空隙。使用XRD和区域模式XPS确认在NST焊盘上选择性沉积AU。该方法是形成由NST和金属组成的微米级纳米复合特征的一般途径,其可用于无电沉积。

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