This work presents a system-level study of power supply noise coupling between different power distribution networks (PDN). Our subject system is built around a large programmable SoC device. Such devices are used in a variety of cutting-edge applications: AI, Cloud, IoT, etc. An SoC chip hosts many different blocks with different power demands, restrictions, and requirements. Different blocks need to operate side by side and interact with each other. Insuring power integrity of such a system becomes challenging. It is particularly difficult to manage noise coupling via shared return path. Such coupling mechanism is sometimes referred to as 'ground bounce'. Our study includes pre-silicon modeling, hardware verification, and correlation steps.
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