PCI Express 5.0 Solution Extending Study Through PCB Stackup and Geometry Optimization

摘要

HSIO (High Speed IO) differential interfaces solution space is shrinking as speed goes higher and higher even after applying upgraded and higher cost PCB materials. Three enablers based on stackup and geometry are analyzed, which includes copper thickness, core and prepreg thickness, and differential routing trace width and spacing. By applying these enables and together with a library covering popular PCB materials, a PCB routing case study on a PCIe 5.0 channel is analyzed and up to 2.6 inches solution space extension is seen after using 5-mil core.