Design and fabrication of a polymer-based micron-scale semi-spherical vertical interconnecting structure for 3D photonic integrated circuit application

摘要

A vertically interconnected structure is a key feature of a photonic integrated circuit application, like an optical printed circuit board. Conventional vertical interconnecting structures have a 45 degree mirror, with or without metal coating to enhance its reflectance. We have designed a curved-shape semi-spherical type vertical interconnecting structure to enhance vertical interconnecting efficiency, and also developed simple fabrication procedure to realize it.