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Three-dimensional structuring of silicon for photonic crystals with complete photonic bandgaps

机译:完全光子带状带状带晶体的光子晶体三维结构

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The fabrication of three-dimensional photonic bandgap materials and the controlled incorporation of point, linear and planar defects into these crystals is a major challenge in materials research today. We show in this report that these purposes can be achieved by photoelectrochemical etching of lithographically prestructured silicon. Our advanced etching method allows the fabrication of three-dimensional photonic crystals with simple cubic symmetry. The performed calculations suggest complete bandgaps of 5% for the realized bulk structures. By lithographic prestructuring vertical line and planar defects can be induced, whereas horizontal planar defects can be created during the etching step. By combining both structuring techniques point defects can be fabricated.
机译:三维光子带隙材料的制造和对这些晶体中的点,线性和平面缺陷的控制掺入是材料研究中的主要挑战。我们在本报告中展示了这些目的,可以通过光刻预定硅的光电化学蚀刻来实现这些目的。我们的高级蚀刻方法允许用简单的立方对称性制造三维光子晶体。所执行的计算表明实现的散装结构的完整带盖为5%。通过光刻预测垂直线和平面缺陷可以诱导,而可以在蚀刻步骤期间产生水平平面缺陷。通过组合结构化技术点缺陷可以制造。

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