Investigation on Devised Procedures for Direct Junction of Packing Laminate Films

摘要

Junction of films themselves can often be seen in laminate films for liquid packing. In most cases, it is performed using adhesive tapes, where contents may be leaked out due to tape thickness. Accordingly, tape junctions will usually be removed through interrupting the machine operation at every junction, while causing losses of the time, contents and films. In this study, procedures for direct junction of film themselves without adhesive tape, were investigated, conducting characteristic tests for tensile strength and liquid leak, and comparing them with conventional junction procedures in production loss. As a result, new junction procedures with high strength, no liquid leak, and a few production losses, have been devised.