New Improved Polyimides for Increased Reliability

摘要

A Design of Experiment (DOE) was conducted to determine the best filler, or combination of fillers that would offer the best reduction of CTE expansion from 50°C to 260°C without compromising electrical, chemical, mechanical or thermal performance of the base Polyimide resin. Our study here shows that a unique combination of fillers can reduce the percent z-axis expansbn of a V0 Polyimide from 1.45% total expansion to 1.28% better than any single type of filler. Thus offering higher reliability in Printed Wiring Board (PWB) applications that continuously operate in conditions of severe thermal cycling.