Advanced Reinforcement Technology Presents New Design Opportunities for Printed Circuit Boards

摘要

An innovative approach to glass fiber reinforcement in laminates offers a flatter, thinner weave that result in a smoother, more uniform surface for mechanical and laser drilling as well as improved dimensional stability. The manufacturing process has been completely redesigned to be more efficient and flexible. Glass fabric produced with this new process offers superior properties for high performance circuitry, including lower Dk and Df values, enhanced PTFE compatibility and the opportunity for improved CAF resistance.