FVSS (Free Via Stacked up Structure)

摘要

The miniaturization of mobile electronic devices continues, market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time, the demand for increased functionality of mobile devices has required the PWB to realize higher density patterning to accommodate more and narrower pitch CSPs on a smaller and thinner PWB. In order to meet these market demands, IBIDEN has developed a stacked-via structure PWB called "FVSS" (Free Via Stacked-up Structure). This structure is achieved by filled-via technology, a core technology that fills a laser-drilled hole with copper plating. The mass production of this technology started in 1st quarter of 2004, and it has proved that, compared to a conventional type of PWB, design flexibility and total board thickness can be significantly improved. More details regarding the design flexibility, electric characteristics, and reliability will follow.