Novel High-Dielectric Constant Prepreg Materials

摘要

This poster presentation will describe the development of novel high dielectric constant prepreg materials. Many embedded capacitor materials are supplied as very thin copper-clad laminates, and can require special design and handling procedures due to their inherently brittle nature. By using expanded poly (tetrafluoroethylene) (ePTFE) as a binder and reinforcement, very thin and mechanically robust prepregs can be produced which enable simplified design and standard processing techniques. The ePTFE reinforcement allows for the incorporation of fairly high loading of para or ferroelectric particles, in order to obtain composite dielectric constant values greater than 10, while still maintaining good mechanical strength. Through the selection and content of thermoset resin, dielectric loss as low as 0.002 (measured at 2.9 GHz) can also be achieved at these high dielectric constants, providing a material well suited for high frequency applications. The ePTFE composite can also be made to be very thin, resulting in specific capacitance values greater than 0.5 nF/cm2. Results from compositional studies showing material and electrical properties as a function of resin type, particle type, and particle loading will be presented.