REDESIGNS OF HSOP PACKAGE FOR HIGH POWER CONSUMPTION BASED ON THE NUMERICAL THERMAL SIMULATION ANALYSIS

摘要

A Heat Slug Outline Package (HSOP) with different design concepts to improve its thermal performance is investigated. The thermal performance of the standard designs of TSSOP usually could not pass the requirements for greater functional integration in wireless frequency and reduction in power consumption, e.g. for a radio frequency (RF) front-end IC's in silicon its power consumption can be increased about twice when the design frequency increases from 2.0 GHz to 3.5 GHz. The configuration of HSOP28 proposed here is redesigned based on the Thin Shrink Small Outline Package (TSSOP) that is a plastic encapsulated semiconductor device complied with a standard Surface Mount Technology (SMT). In order to accommodate a chip with the same size but double it power consumption, various types of lead frame design for HSOP packages are studies. It is therefore an object of the present study to investigate what will be the maximum thermal improvement of HSOP package compared to the corresponding same size of TSSOP package, which is also related to further reliability issue of this type of IC package, i.e. the thermal fatigue life calculation. Studies presented here are also taken into account the thermal performance of HSOP package associated with different multi-layers PCB designs and the thermal conductivity variations, where the package internal heat conduction as function of board thermal conductivity can be made.