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A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects

机译：一种多芯片直接安装的512 MEMS镜阵模块，具有密封包装，用于大型光学交叉连接

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《IEEE/LEOS International Conference on Optical MEMS and Their Applications Conference 》|2005年||共2页
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Xiaoyu Mi; Soneda H.; Okuda H.; Tsuboi O.; Norinao; Kouma; Mizuno Y.; Ueda S.; Sawaki I.;
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中图分类自动化技术、计算机技术 ;
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1. Amulti-chip directly mounted 512-MEMS-mirror array module with a hermetically sealed package for large optical cross-connects [J] . Mi XY, Soneda H, Okuda H, Journal of optics, A. Pure and applied optics: journal of the European Optical Society . 2006 ,第7期

机译：多芯片直接安装的512-MEMS镜阵列模块，具有用于大型光学交叉连接的密封封装
2. 512 × 512 Port 3D MEMS Optical Switch Module with Toroidal Concave Mirror [J] . Yuko Kawajiri, Naru Nemoto, Koichi Hadama, NTT Technical Review . 2012 ,第11期

机译：带有环形凹面镜的512×512端口3D MEMS光开关模块
3. A V-band, high gain, low noise, monolithic PHEMT amplifier mounted on a small hermetically sealed metal package [J] . Itoh Y., Horiie Y. IEEE Microwave and Guided Wave Letters . 1995 ,第2期

机译：V波段，高增益，低噪声，单片PHEMT放大器，安装在小型密封金属封装上
4. A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects [C] . Xiaoyu Mi, Soneda, H., . 2005

机译：多芯片直接安装的512 MEMS反射镜阵列模块，具有用于大型光学交叉连接的密封封装
5. Low temperature hermetically sealed three-dimensional MEMS device for wireless optical communication [D] . Agarwal, Rahul 2007

机译：用于无线光通信的低温密封三维MEMS器件
6. Circumferential-scanning endoscopic optical coherence tomography probe based on a circular array of six 2-axis MEMS mirrors [O] . Site Luo, Dan Wang, Jianyu Tang, 2018

机译：基于六个2轴MEMS镜的圆形阵列的周向扫描内窥镜光学相干断层扫描探头
7. Hermetic package for optical MEMS [O] . F. Seigneur, Y. Fournier, T. Maeder, 2008

机译：用于光学mEms的密封封装
8. Aerospace Sensor Component and Subsystem Investigation and Innovation-2 Component Exploration and Development (ASCSII-2 CED) Delivery Order 0003: Hermetically Sealed Cavities in 3-D GaAs-Silicon and Silicon-Silicon Packages for Microelectromechanical System (MEMS) Devices Using Selective and Large-Scale Bonding [R] . Malshe, A. P. 2003

机译：航空航天传感器组件和子系统调查与创新-2组件探索与开发（asCsII-2 CED）交付订单0003：采用选择性和大型的微机电系统（mEms）器件的三维Gaas硅和硅硅封装的气密密封腔 - 规模粘合

A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects

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