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Features of electroforming in open 'sandwich'-structures Si-SiO_2-W for silicon of different types of conductivity

机译:开放式“夹心”电铸的特点 - 不同类型电导率的硅Si-SiO_2-W

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The results of experiments on research of electroforming processes in open "sandwich"-structures Si-SiO_2-W (silicon - silicon dioxide - tungsten) with thickness of silicon dioxide about 20 nm are shown. The basic distinction for silicon of p-and n-types conductivity is marked: in the first case usual for electroforming N-type current-voltage characteristic and in the second S-type curve typical for electric breakdown with thermal instability are observed. The mechanisms of processes are discussed. The marked distinction is connected with the fact that in structures n-Si-SiO_2-W the current is transported basically by electrons which dissociative attachment to molecules on a surface of an insulating slit leads to their destruction and conductive phase particles formation from them. In a current through structures p-Si-SiO_2-W the electrons prevail only at initial moments of electroforming, in process of conductive medium accumulation their share falls by one - two orders, and the current is transported basically by holes, which cannot participate during formation of conductive phase particles.
机译:示出了在开放的“夹层” - 结构上具有约20nm的二氧化硅厚度的Si-SiO_2-W(二氧化硅 - 二氧化钨)的电铸过程研究结果。标记了P-and N型电导率的硅的基本区别:在常规情况下,用于电铸N型电流 - 电压特性,并且在典型的第二S型曲线中观察到具有热不稳定性的典型的典型。讨论了过程的机制。标记的区别与结构中的事实相连,基本上通过电子通过电子传送到绝缘狭缝表面上的分子上的电子传输,导致它们的破坏和导电相粒子形成。在通过结构的电流中,电极仅在电铸的初始时刻普遍,在导电介质积累的过程中,它们的份额由一张 - 两个订单下降,并且电流基本上由孔输送,孔不能参加形成导电相粒子。

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