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High brightness LEDs for general lighting applications Using the new ThinGaN~(TM)-Technology

机译:高亮度LED用于使用新的东西〜(TM) - 技术

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During the last years GaN-technology has proven to fulfill the requirements of solid state lighting. Lighting requirements are mainly driven by brightness, operation voltage and lifetime. Brigthness is determined by internal efficiency as well as extraction efficiency whereas the ohmic losses determining the operating voltage are dominated by series resistance and contact resistance. Both, brightness and voltage, strongly depend on the device structure as well as the chip design. SiC based [1, 2] as well as Sapphire based LEDs [3] have proven their capability for high brightness devices, still suffering from various compromises such as cost, ESD-stability, high series resistance etc. Recently OSRAM-OS has demonstrated its newly developed product line based on the so called ThinGaNTM technology, a true thinfilm approach that overcomes most of the compromises mentioned. The technology allows highest brightness levels at lowest operating voltage, is scalable and supports all wavelengths. The devices act as true surface emitters with a lambertian emission pattern.
机译:在过去几年中,GaN-Technology已被证明满足固态照明的要求。照明要求主要由亮度,操作电压和寿命驱动。广场由内部效率以及提取效率决定,而确定工作电压的欧姆损耗是由串联电阻和接触电阻的主导。两者都呈亮度和电压,强烈取决于器件结构以及芯片设计。基于SIC [1,2]以及基于蓝宝石的LED [3]已经证明了它们对高亮度器件的能力,仍然遭受各种折衷,例如成本,eSD稳定性,高串联电阻等。最近osram-os已证明其新开发的产品线路基于所谓的Thingantm技术,一种真正的薄型方法,克服了大多数所提到的妥协。该技术允许最低工作电压下的最高亮度水平,可缩放并支持所有波长。该器件充当具有灯泡排放图案的真实表面发射器。

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