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Development of Deformation Microtwins in Cu-Ni-Mn Continuously Cast Alloys

机译:Cu-Ni-Mn连续铸造合金中变形微量杂环的研制

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Microstructural studies involving transmission electron microscopy (TEM) have revealed that there is a transition of deformation mechanism from cross slip to twinning due to inhomogeneous distribution of stresses. A localized higher concentration of stresses due to a strong initial preferred orientation causes the onset of twinning. Micro diffraction revealed microtwins of less than 0.02 mu m in thickness, lying on {111} traces. All of the collected patterns around areas adjacent to the microtwinning are of the 110 type diffraction pattern with extra spots due to microtwinning. The misorientation between adjacent microtwinned regions is about 5 deg around the 110 pole. The existence of a high density of defects inside the microtwins is confirmed by the elongated spots in the selected area diffraction pattern. The transition from microband to microtwin formation is believed to be dependent on a localized concentration of stresses, while solute addition and stacking fault energy are believed to play a limited role.
机译:涉及透射电子显微镜(TEM)的微观结构研究表明,由于不均匀的应力分布,存在变形机制的变形机制转变为孪晶。由于强的初始优选取向导致孪生的局部浓度较高。微衍射显示厚度小于0.02μm的微管,躺在{111}迹线上。围绕微杂体附近的区域周围的所有收集的图案都是110型衍射图案,由于微线引起的额外斑点。相邻的微缠绕区域之间的误导在110极围绕着大约5°。在所选择的区域衍射图案中的细长斑点确认了微管内部的高密度缺陷。从微生物到微杂​​体形成的过渡被认为依赖于局部的应力浓度,而据信溶质加成和堆叠故障能量起到有限的作用。

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