首页> 外文会议>Conference on millimeter and submillimeter detectors for astronomy >Design and fabrication of two-dimensional semiconducting bolometer arrays for the High resolution Airborne Wideband Camera (HAWC) and the Submillimeter High Angular Resolution Camera II (SHARC- II)
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Design and fabrication of two-dimensional semiconducting bolometer arrays for the High resolution Airborne Wideband Camera (HAWC) and the Submillimeter High Angular Resolution Camera II (SHARC- II)

机译:用于高分辨率空机宽带照相机(HAWC)的二维半导体钻头阵列的设计和制造和亚倍数高角度分辨率相机II(SHARC-II)

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The High resolution Airborne Wideband Camera (HAWC) and the Submillimeter High Angular Resolution Camera II (SHARCII) will use almost identical versions of an ion-implanted silicon bolometer array developed at the National Aeronautics and Space Administration's Goddard Space Flight Center (GSFC). The GSFC "Pop-Up" Detectors (PUD's) use a unique folding technique to enable a 12 x 32-element close-packed array of bolometers with a filling factor greater than 95 percent. A kinematic Kevlar~R suspension system isolates the 200 mK bolometers from the helium bath temperature, and GSFC ― developed silicon bridge chips make electrical connection to the bolometers, while maintaining thermal isolation. The JFET preamps operate at 120 K. Providing good thermal heat sinking for these, and keeping their conduction and radiation from reaching the nearby bolometers, is one of the principal design challenges encountered. Another interesting challenge is the preparation of the silicon bolometers. They are manufactured in 32-element, planar rows using Micro Electro Mechanical Systems (MEMS) semiconductor etching techniques, and then cut and folded onto a ceramic bar. Optical alignment using specialized jigs ensures their uniformity and correct placement. The rows are then stacked to create the 12 x 32-element array. Engineering results from the first light run of SHARC II at the Caltech Submillimeter Observatory (CSO) are presented.
机译:高分辨率空气宽带摄像头(HAWC)和亚丘比特高角度分辨率相机II(SHARCII)将在美国国家航空航天局戈达德航天飞行中心(GSFC)开发的离子植入硅钻头阵列的几乎相同的版本。 GSFC“弹出”探测器(PUD)使用独特的折叠技术来实现12 x 32元件的钻孔仪,填充因子大于95%。运动Kevlar〜R悬架系统将200 Mk钻头温度分离出200 mk钻头,而GSFC开发的硅桥芯片与钻头仪进行电气连接,同时保持热隔离。 JFET前置放大器在120 k下运行。为这些提供良好的热散热,并保持其传导和辐射到达附近的钻头,是遇到的主要设计挑战之一。另一个有趣的挑战是制备硅钻头。它们在32元件中制造使用微电机械系统(MEMS)半导体蚀刻技术,然后切成并折叠到陶瓷棒上。使用专用夹具的光学对准确保其均匀性和正确的放置。然后堆叠行以创建12 x 32元素阵列。提出了由CALTECH Sublimeter天文台(CSO)的SHARC II的第一次光线的工程结果。

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