Development of micro-sensor embedded in die for metal forming

摘要

Using semiconductor processing technology, micro-sensor which embedded in die was fabricated, and a measurement system with a wireless signal processing unit to measure deformation information that is difficult to get directly in metal forming was developed. In this paper, we applied the sensing system to V-bending process by embedding the micro sensor unit into die to get the information of strain distribution, and by this way, the load and the angle during the processing could be measured with high precision.