INFLUENCE OF TEMPERATURE ON THE CREEP PROPERTIES OF Sn-Ag-Cu SOLDER REINFORCED WITH MULTI-WALLED CARBON NANOTUBES

摘要

In this study, Sn-Ag-Cu based nanocomposites with multi-walled carbon nanotubes (MWCNTs) as reinforcements were successfully synthesized using the powder metallurgy technique. Varying weight percentages of MWCNTs were blended together with micron size lead-free solder particles. The blended powder mixtures were then compacted, sintered and finally extruded at room temperature. The extruded materials were then used to prepare samples for creep tests. Miniature creep samples were created using a specially designed fixture and static loading creep tests were carried out on the solder joint samples at 25 deg C, 75 deg ?C and 125 deg C. Creep results showed improved creep resistance with the addition of MWCNTs. An attempt is made in the present study to correlate the variation in weight percentages of reinforcement with the creep properties of the resultant nanocomposite materials.