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Microsecond Bus (μSB): The New Open-Market Peripheral Serial Communication Standard

机译:微秒总线(μSB):新的开放式外设串行通信标准

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For the past approximately 20 years, the Serial Peripheral Interface (SPI) has been the established standard for serial communication between a host or central microprocessor and peripheral devices. This standard has been used extensively in control modules covering the entire spectrum of automotive applications as well as non-automotive applications. As the complexity of engine control modules grows, with the number of vehicle actuators being controlled and monitored increasing, the number of loads the central microprocessor has to manage is growing accordingly. These loads are typically controlled using discrete and pulse-width modulated (PWM) outputs from the microcontroller when real-time operation is essential or via SPI when real-time response is not critical. The increase of already high pin- count on microcontrollers, the associated routing effort and demand for connected power stages is a concern of cost and reliability for future ECU designs. Commonly used methods such as daisy-chaining peripheral devices via SPI or using an SPI bus with a chip-addressing scheme to reduce the number of chip select signals required offer at best an incremental improvement to system capability and do not sufficiently support higher integration of power stages nor common chip set approaches across platforms. These challenges have been addressed with the definition of the new microsecond bus (μSB) interface standard, where implementations are already available with leading microcontroller architectures and a peripheral low-side driver device.
机译:在过去大约20年中,串行外围接口(SPI)是主机或中央微处理器和外围设备之间的串行通信的既定标准。该标准已广泛用于控制模块,涵盖整个汽车应用以及非汽车应用。随着发动机控制模块的复杂性的增长,随着被控制和监测的车辆致动器的数量增加,中央微处理器必须管理的负载的数量相应地增长。当实时操作是必不可少的或通过SPI时,通常使用来自微控制器的离散和脉冲宽度调制(PWM)输出的离散和脉冲宽度调制(PWM)来控制这些负载。对微控制器的高引脚数量的增加,相关的路由工作和对连接电力级的需求是未来ECU设计的成本和可靠性的关注。通常使用的方法,例如菊花链式外围设备通过SPI或使用具有芯片寻址方案的SPI总线来减少芯片选择信号的数量,以便对系统能力的增量提高增量提高,并且不充分支持更高的功率集成阶段或普通芯片组跨平台接近。通过新的微秒总线(μSB)接口标准的定义,已经解决了这些挑战,其中有领先的微控制器架构和外围低端驱动器设备已经提供了实现。

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