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Determining the Optimal Distributed Electronic Module Solution of an Automotive System While Incorporating Harness Routing Alternatives in an Electrical/Electronic Architecture Tool Environment

机译:确定汽车系统的最佳分布式电子模块解决方案,同时在电气/电子架构工具环境中结合了线束路由替代品

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Vehicle packaging and build requirements often impact the size and routing of electrical harnesses utilized in vehicles. More specifically, OEMs (Original Equipment Manufacturers) often have strict vehicle manufacturing requirements on electronic module locations and harness parameters such as mass, bundle diameter, and routing requirements. The module location and the wiring parameters have a direct impact on the overall vehicle Electrical/Electronic (E/E) Architecture. For example, mass may impact whether or not machine assistance is required for installation or if additional inline connections are required. Bundle diameter may impact front of dash pass through design or it may force partitioning of electronic content. Harness routing may impact the possible distribution of electrical and electronic content in a vehicle. In other words, the vehicle's overall E/E architecture efficiency, as measured by an OEM, is impacted by not only where the electronics are located in a vehicle but also by the electrical structure of the vehicle. This paper will show that through the use of an E/E Architecture analysis tool environment, vehicle manufacturing alternatives, with respect to harness routing options and electronic module placement, can be incorporated to identify an optimal E/E solution. A baseline architecture will be examined with an analysis tool. Different alternatives of electronic distribution will then be compared against the baseline to demonstrate the limits of architecture optimization when the analysis is limited with fixed harness and fixed module location constraints. As these different levels of optimization are discussed, the author will point out features that E/E architecture analysis tools should incorporate. Finally, various harness routing options combined with new electronic content distribution will be examined to show how an optimal solution is achievable utilizing an E/E Architecture analysis too.
机译:车辆包装和构建要求通常会影响车辆中使用的电线束的尺寸和路由。更具体地说,OEM(原始设备制造商)通常具有严格的电子模块位置和线束参数,如质量,束直径和布线要求。模块位置和布线参数对整个车辆电气/电子(E / e)架构有直接影响。例如,质量可能会影响安装时是否需要机器辅助,或者是否需要额外的内联连接。束直径可能会撞击仪表划线穿过设计,或者可能强制划分电子内容。线束路由可能会影响车辆中电气和电子含量的可能分布。换句话说,由OEM测量的车辆的总体E / E架构效率不仅受到电子设备位于车辆中而且由车辆的电气结构的影响而受到影响。本文将显示,通过使用E / E架构分析工具环境,可以结合到线束路由选项和电子模块放置的车辆制造替代品,以识别最佳E / E解决方案。将通过分析工具检查基线架构。然后将与基线进行比较电子分布的不同替代方案,以便在分析限制固定的线束和固定模块位置约束时展示架构优化的限制。随着这些不同级别的优化级别,作者将指出E / E架构分析工具应包含的功能。最后,将研究各种线束路由选项与新的电子内容分布相结合,以显示如何利用E / E架构分析实现最佳解决方案。

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