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Silicon Advances Driving Automotive Electronics into the Next Decade

机译:硅推进了在未来十年内推动汽车电子产品

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Embedded processors are incorporated into almost every type of electronic device. The automobile is no exception where the expectations for new features like high reliability, improved fuel economy and better overall system performance with each generation. Technology advances in engines and the ultimate "Green Machines" will require new approaches to solving many of the current technology barriers of today. Semiconductors will participate as an ever-increasing part in breaking through many of the technical challenges with higher voltage power semiconductors, new memory technologies, increased performance of the embedded processor and improvements in timing control functions. Improvements in semiconductor technology are enabling new solutions to current and even future technical barriers within the automotive electronics industry. The powertrain, body, chassis, safety and infotainment systems will all benefit from higher performance embedded processors and advances in power electronics. Microcontrollers now contain over 30 million transistors and will push beyond 60 million transistors in 2008. Power electronics will reach higher power applications with improvements in current and increased voltage handling capabilities. The embedded processor has been used to solve repetitive task requiring procession timing and a high degree of reliability for 30 years. This drive for improved reliability and system capabilities with smaller packages and lower cost are helping to accelerate silicon down an integration path. Silicon suppliers will use deep sub-micron 130 to 90 nanometer geometries to design highly integrated 32-bit embedded processors to meet the new system-on-a-chip demands.
机译:嵌入式处理器纳入几乎每种类型的电子设备。汽车并不例例,其中对新功能的预期,如高可靠性,提高燃油经济性和每代更好的整体系统性能。发动机和终极“绿色机器”的技术进步将需要解决当前当前技术障碍的新方法。半导体将作为越来越多的部分突破具有较高电压功率半导体,新的记忆技术,嵌入式处理器的性能的许多技术挑战,以及定时控制功能的改进。半导体技术的改进是为汽车电子行业内的当前甚至未来技术障碍的新解决方案。动力总成,车身,底盘,安全和信息娱乐系统都将受益于高性能嵌入式处理器和电力电子设备的进步。微控制器现在包含超过3000万晶体管,并在2008年推出超过6000万晶体管。电力电子设备将达到更高的电源应用,随着电流的改进和增加的电压处理能力。嵌入式处理器已被用于解决需要处理时间的重复任务和30年的高度可靠性。此驱动器可提高可靠性和系统功能,具有较小的包,较低的成本有助于加速硅沿着集成路径。硅供应商将深亚微米130至90纳米几何形状设计高度集成的32位嵌入式处理器,以满足新的芯片需求。

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