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Microstructure and thermoelectric properties of n-type 95Bi_2Te_3-5Bi_2Se_3 alloy produced by rapid solidification and hot extrusion

机译:N型95%Bi_2Te_3-5%Bi_2Se_3合金的微观结构和热电性能,通过快速凝固和热挤压生产

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n-type SbI_3-doped Bi_2Te_(2.85)Se_(0.15) compounds were prepared by a rapid solidification and extrusion at the temperature range 420~480°C using a ratio of 25:1. The microstructure and thermoelectric properties of the compounds were investigated. The fabricated powder consists of homogeneous Bi_ 2Te_3+Bi_2Se_3 solid solution and the theoretical density of over 99% was obtained by hot extrusion. The values of Seebeck coefficient for the compounds hot extruded at 420, 450, and 480□ were -160.8, -170.2, and -165.7□ E K~(-1) respectively. The values of electrical resistivit y(□) for the compounds hot extruded at 420, 450, and 480□ were 0.49, 0.57, and 0.51x 10~(-5)□ m, respectively. The maximum value of power factor of the compounds hot extruded at 480°C was 5.384mW/mK~2.
机译:通过使用25:1的比率在420〜480℃的温度范围内的快速凝固和挤出来制备n型Sbi_3掺杂的Bi_2Te_(2.85)化合物。研究了化合物的微观结构和热电性能。制造的粉末由均相Bi_2St_3 + Bi_2Se_3的固溶体组成,通过热挤出获得超过99%的理论密度。在420,450和480℃下热挤出的化合物的塞贝克系数的值分别为-160.8,-170.2和-165.7□-1(-1)。在420,450和480℃下热挤出的化合物的电阻y(□)的值分别为0.49,0.57和0.51×10〜( - 5)□。在480℃下热挤出的化合物的功率因数的最大值为5.384mW / mk〜2。

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