首页> 外文会议>2002 World Congress on Powder Metallurgy amp; Particulate Materials Pt.3 Jun 16-21, 2002 Orlando, FI >Microstructure and thermoelectric properties of n-type 95Bi_2Te_3-5Bi_2Se_3 alloy produced by rapid solidification and hot extrusion
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Microstructure and thermoelectric properties of n-type 95Bi_2Te_3-5Bi_2Se_3 alloy produced by rapid solidification and hot extrusion

机译:快速凝固和热挤压制备的n型95%Bi_2Te_3-5%Bi_2Se_3合金的组织和热电性能

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摘要

n-type SbI_3-doped Bi_2Te_(2.85)Se_(0.15) compounds were prepared by a rapid solidification and extrusion at the temperature range 420~480℃ using a ratio of 25:1. The microstructure and thermoelectric properties of the compounds were investigated. The fabricated powder consists of homogeneous Bi_ 2Te_3+Bi_2Se_3 solid solution and the theoretical density of over 99% was obtained by hot extrusion. The values of Seebeck coefficient for the compounds hot extruded at 420, 450, and 480□ were -160.8, -170.2, and -165.7□ E K~(-1) respectively. The values of electrical resistivit y(□) for the compounds hot extruded at 420, 450, and 480□ were 0.49, 0.57, and 0.51x 10~(-5)□ m, respectively. The maximum value of power factor of the compounds hot extruded at 480℃ was 5.384mW/mK~2.
机译:通过在420〜480℃的温度范围内以25:1的比例快速凝固并挤出制备n型掺SbI_3的Bi_2Te_(2.85)Se_(0.15)化合物。研究了化合物的微观结构和热电性能。制备的粉末由均匀的Bi_2Te_3 + Bi_2Se_3固溶体组成,通过热挤压获得的理论密度超过99%。在420、450和480℃热挤出的化合物的塞贝克系数分别为-160.8,-170.2和-165.7□E K〜(-1)。在420、450和480□热挤压的化合物的电阻率y(□)分别为0.49、0.57和0.51x 10〜(-5)□m。 480℃热挤压复合材料的功率因数最大值为5.384mW / mK〜2。

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