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ELECTRICAL PROPERTIES OF ADHESIVE JOINTS

机译:粘合剂的电气性能

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Isotropic electrically conductive adhesives are usually manufactured with filler concentration sufficiently greater than percolation threshold to guarantee low resistance with allowance for manufacturing tolerances. But joint resistance and other electrical properties of adhesive joints depend on filler particle shapes and dimensions. The silver flakes, "heavy" silver and nano-silver powder as well as specially prepared highly porous very light silver particles were used as fillers. Adhesives were formulated on the base of two kinds of resin with two levels of the volume content of filler in adhesive. It was stated that the silver flakes with the particle size distribution ranges from 1 to 20μm with the maximum of 2 - 4μm, generally, is the best filler material. However, the adhesive with "heavy" silver manufactured on the base selected resin has lower joint resistance and the adhesive with porous silver are characterized by lower value of temperature coefficient of resistance. When volume content of filler in adhesive is greater than percolation threshold, the influence of the volume content on electrical properties of adhesive joints is statistically not important.
机译:各向同性导电粘合剂通常以足够大于渗透阈值的填充浓度制造,以确保低耐受制造公差的余量。但粘合剂接头的关节电阻和其他电性能取决于填充颗粒形状和尺寸。银薄片,“重”银和纳米银粉末以及特别制备的高度多孔非常轻的银颗粒用作填料。用两种树脂的底部配制粘合剂,其中粘合剂中的填料的体积含量为两种树脂。据说粒度分布的银薄片的范围为1至20μm,最大值为2-4μm,通常是最好的填充材料。然而,在基础选定的树脂上制造的“重”银具有较低的接头电阻,并且具有多孔银的粘合剂的特征在于较低的温度抗性值。当粘合剂中填料的体积含量大于渗透阈值时,体积含量对粘性接头的电性能的影响是统计学上的。

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