首页> 外文会议>European Microelectronics Packaging Interconnection Symposium >UNDERSTANDING THE 'IMMUNITY LEVEL' AND 'EM COMPATIBILITY' OF ELECTRONIC PACKAGING WITH EMBEDDED EMI SHIELDING
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UNDERSTANDING THE 'IMMUNITY LEVEL' AND 'EM COMPATIBILITY' OF ELECTRONIC PACKAGING WITH EMBEDDED EMI SHIELDING

机译:了解电子包装与嵌入式EMI屏蔽的“豁免水平”和“EM兼容性”

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The European community directive 89/336/EEC defines the "electromagnetic compatibility" as the ability for two or more electronic components or units to co-exist without interference. This is more clearly stated in the forefront text of the EEC Directive:".For providing adequate protection for radio-communications and the devices, apparatus or systems whose performance may be degraded by electromagnetic disturbance produced by electrical and electronic apparatus against the degradation caused by such disturbances". From the electronic packaging development standpoint this matter has clearly a double aspect. The first one addresses the component package capability in "keeping-out" external electromagnetic waves, while the second aspect is the property of the same packaging technique in containing the device electromagnetic waves emissions detrimental to the other neighboring components. Products miniaturization trends are making traditional EMI shielding techniques more and more difficult to be used adding major system design concerns. Electronic packages with embedded EMI shields are a possible solution to these problems. They allow the realization of systems with different components in close proximity reducing the need to implement shields at system level. "Immunity level" and "Electromagnetic compatibility" represents the level of effectiveness of EMI shielding and an understanding of this properties in the electronic package design becomes a key factor. This paper introduces to the work performed in designing an experiment to validate the effectiveness of an embedded EMI shielding into a EGA cavity down electronic package. The task included a test board design with an embedded patch microstrip antenna, the antenna design within the dimensional limitation given by the physical outline of the electronic module, and the overall system gain optimization for performance within the desired frequencies range.
机译:欧洲社区指令89/336 / EEC定义了“电磁兼容性”,作为两个或多个电子元件或单位在不干扰的情况下共存的能力。 EEC指令的最前沿文本更清楚地说明:“。用于为无线电通信提供足够的保护,其性能可以通过电气和电子设备产生的电磁干扰来降低劣化的劣化这种干扰“。从电子包装开发的角度来看,这件事情显然是一个双面。第一个地解决了“保持出”外部电磁波中的组件封装能力,而第二方面是在包含对另一个相邻部件的装置电磁波排放的相同包装技术的性质。产品小型化趋势正在制造传统的EMI屏蔽技术越来越难以使用添加主要的系统设计问题。具有嵌入式EMI屏蔽的电子包是可能解决这些问题的解决方案。它们允许在密切接近的情况下实现具有不同组件的系统,从而减少在系统级实现屏蔽的需要。 “免疫水平”和“电磁兼容性”表示EMI屏蔽的有效性,并且在电子封装设计中对该特性的理解成为关键因素。本文介绍了在设计实验时进行的工作,以验证嵌入式EMI屏蔽到EGA腔腔下的电子包装中的效果。该任务包括具有嵌入式补丁微带天线的测试板设计,天线设计在电子模块的物理轮廓上的尺寸限制内,以及整体系统在所需频率范围内的性能获得优化。

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