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Electromechanical Response of Multilayered Polymer Films for High Energy Density Capacitors

机译:高能密度电容器多层聚合物膜的机电响应

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Multilayered films comprising alternating layers of polycarbonate (PC) and poly(vinylidene fluoride-hexafluoropropylene) (P[VDF-HFP]) show an enhanced dielectric strength (E_B> 750 kV/mm) and an increased energy storage density (U_d ~ 13.5 J/cm~3) compared to monolithic PC and P[VDF-HFP] films. Here the role of electromechanical effects in the breakdown of multilayer films is explored both by imaging the changes in the layer structure caused by electrical fields below the breakdown field and by a direct measurement of the strain in multilayer PC/P[VDF-HFP] films subjected to similar fields. Focused Ion Beam (FIB)/Scanning Electron Microscopy (SEM) images of the layer structure in films subjected to repeated cycles at near-breakdown fields showed local changes in the thickness of individual layers, suggesting that mechanical forces arising from field-induced compression may play a role in the steps preceding the breakdown. The directly measured field induced strain showed evidence for both an elastic and a flow component to the strain. The mechanical responses of films with < 50 vol% P[VDF-HFP] were modeled as simply the sum of an elastic and viscous flow. The observed electromechanical properties vary with the layer structure. This suggests that multilayering polymers may provide a means to mitigate deleterious electromechanical effects in low modulus, high dielectric materials.
机译:多层膜,包括聚碳酸酯(PC)和聚(偏二氟乙烯 - 六氟丙烯)的交替层(P [VDF-HFP])显示增强的介电强度(E_B> 750kV / mm)和增加的储能密度(U_D〜13.5 J. / cm〜3)与单片PC和P [VDF-HFP]薄膜相比。在这里,通过对击穿场下方的电场引起的层结构的变化和多层PC / P [VDF-HFP]膜中的应变直接测量,通过对多层膜的破坏中的作用进行探索的作用。经受类似的领域。近击穿田间经受重复循环的薄膜中的聚焦离子束(FIB)/扫描电子显微镜(SEM)图像的层结构显示了各层厚度的局部变化,表明从场诱导的压缩中产生的机械力可以在崩溃前面的步骤中发挥作用。直接测量的场诱导应变显示出弹性和流动分量的证据。用<50Vol%P [VDF-HFP]的薄膜的机械响应被建模为弹性和粘性流量的总和。观察到的机电特性随层结构而变化。这表明多层聚合物可以提供减轻低模量,高介电材料的有害机电效应的方法。

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