首页> 外文会议>International conference on solidification science and processing >Study of Microstructural Defects Induced by Thermal Stresses at SIC/AL Interfaces in Metal Matrix Composites
【24h】

Study of Microstructural Defects Induced by Thermal Stresses at SIC/AL Interfaces in Metal Matrix Composites

机译:金属基复合材料中SiC / Al界面热应力诱导的微观应力诱导的研究

获取原文

摘要

The residual lattice strain, the distribution function of the crystallite size, the components of Gaussian and Chauchy functions of the X-ray line profiles obtained by Fourier analysis are correlated with AFM and TEM observations for a better knowledge of the dislocation generation mechanisms at the SiC/Al interface after quenching at low temperature. The results are discussed taking into account the different types of the reinforcing phase (SiC whisker, SiC particles), the thermal stresses induced by rapid cooling, due to low temperature quenching, and the presence of a high concentration of point defects (vacancies) generated by quenching treatments.
机译:残留的晶格菌株,微晶尺寸的分布函数,通过傅立叶分析获得的X射线线谱的高斯和Chauchy功能的组件与AFM和TEM观察相关,以更好地了解SIC的错位生成机制在低温下淬火后/ Al界面。考虑到不同类型的增强阶段(SiC晶须,SiC颗粒),通过快速冷却引起的热应力引起的结果,由于低温淬火,并且产生高浓度的点缺陷(空位)产生的热应力通过淬火治疗。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号