Preparation of Metallic Platinum by Displacement of Copper on Aryl Modified Glassy Carbon Electrodes.

摘要

A new metal deposition method was recently disclosed for the deposition of a submonolayer of Pt, Pd or Ag on Au (111) surfaces. In this procedure, a Cu adlayer on Au (111) was used as template for the deposition of these metals which occured by spontaneous oxidation of Cu by more noble metal ions, which were reduced and simultaneously deposited on Au. On the other hand, the formation of metallic particles on a phenyl modified carbon electrode was recently reported. This procedure involves the adsorption of metallic ionic species at the phenyl modified carbon electrode which bears functional groups that allow the binding of these ions, either electrostatically or through metal- ligand bond formation. The metal- based species are then electrochemically or chemically reduced to form metal particles.