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Semiconductor Product Analysis Challenges Based on the 1999 ITRS

机译:基于1999年ITRS的半导体产品分析挑战

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One of the most significant challenges for technology characterization and failure analysis is to keep instrumentation and techniques in step with the development of technology itself. Not only are dimensions shrinking and new materials being employed, but the rate of change is increasing. According to the 1999 International Technology Roadmap for Semiconductors, "The number and difficulty of the technical challenges continue to increase as technology moves forward." It could be argued that technology cannot be developed without appropriate analytical techniques; nevertheless while much effort is being directed at materials and processes, only a small proportion is being directed at analysis. Whereas previous versions of the Semiconductor Industry Association roadmap contained a small number of implicit references to characterization and analysis, the 1999 ITRS contains many explicit references. It is clear that characterization is now woven through the roadmap, and technology developers in all areas appreciate the fact that new instrumentation and techniques will be required to sustain the rate of development the semiconductor industry has seen in recent years. Lake in 1999, a subcommittee of the Sematech Product Analysis Forum (PAF) reviewed the ITRS and identified a "top-ten" list of challenges which the failure analysis community will face as present technologies are extended and future technologies are developed. This paper discusses the PAF top-ten list of challenges, which is based primarily on the Difficult Challenges tables from each ITRS working group. Eight of the top-ten are challenges of significant technical magnitude; only two could be considered non-technical in nature. Most of these challenges cut across several working group areas and could be considered common threads in the roadmap, ranging from fault simulation and modeling to imaging small features, from electrical defect isolation to deprocessing. While evolutionary changes can be anticipated fairly easily, revolutionary changes require large multi-faceted research efforts. Each of the ten challenges will be discussed in the context of the roadmap, and specific needs in each area will be given.
机译:技术表征和故障分析最重要的挑战是在逐步借助技术本身的发展中保持仪器和技术。不仅尺寸萎缩和采用新材料,而且变化率正在增加。根据1999年的半导体国际技术路线图,“技术挑战的数量和难度随着技术向前发展而继续增加。”可以说,没有适当的分析技术,无法开发技术;尽管如此,虽然努力正在考虑材料和过程,但在分析中只有少量的比例。鉴于以前的半导体行业协会路线图包含少数对特性和分析的隐性引用,1999年ITRS包含许多明确的引用。值得清楚的是,表征现在通过路线图编织,所有领域的技术开发商都赞赏新的仪器和技术将需要维持半导体行业近年来的发展速度。 1999年湖区,SemaTech产品分析论坛(PAF)的小组委员会审查了ITRS,并确定了“十大”挑战列表,失败分析社区将面临着现有技术,并开发了未来的技术。本文讨论了PAF十大挑战列表,主要基于每个ITRS工作组的困难挑战。前十大中的八个是重要的技术幅度的挑战;只有两个可以被认为是非技术性的。这些挑战中的大多数挑战跨越多个工作组区域,可以在路线图中被视为常见的线程,从故障模拟和模拟到成像小功能,从电气缺陷隔离到辅助。虽然进化变化可以相当容易地预测,但革命性的变化需要大量的多方面的研究工作。在路线图的背景下将讨论十个挑战中的每一个,将给出每个区域的特定需求。

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