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Grinding Process and its Influence to Surface Integrity

机译:研磨过程及其对表面完整性的影响

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The friction between the grain and material characterises the grinding in the contact place of the grinding grain with the workpiece, the following elastic and plastic deformation is finished by the chip cutting. The whole process takes place in the real surroundings, which a process liquid forms. The proportion of the dimension of the mechanical and thermal loading, which is caused by the deformation and friction, it predicts the surface quality - the integrity. The following experiment deals especially with the influence of the process liquid.
机译:颗粒和材料之间的摩擦表征在研磨颗粒的接触地点的研磨与工件,通过芯片切割完成以下弹性和塑性变形。整个过程发生在真实的周围环境中,该过程是一种过程液体形式。由变形和摩擦引起的机械和热负荷尺寸的比例,它预测了表面质量 - 完整性。以下实验尤其涉及过程液体的影响。

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