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COMBINATORIAL STUDY OF NICKEL-GOLD P-CONTACTS FOR BLUE INDIUM GALLIUM NITRIDE LIGHT-EMITTING DIODES

机译:蓝铟铟镓发光二极管的镍金p触头组合研究

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Although the efficiency of the Gallium Nitride (GaN) Light Emitting-Diode (LED) has improved in the past decade, a great opportunity for further efficiency improvement lies in the optimization of the Nickel-Gold composition of the p-type GaN metal contacts. The work described here will analyze the properties and performance of LED p-type contacts with varying Nickel-Gold (Ni-Au) compositions. In this work, during the electron-beam deposition of the Ni and Au onto an LED wafer, the relative thicknesses of the two metals were spatially varied to provide a combinatorial array of Ni and Au compositions on a single LED wafer. Each Ni-Au composition on the LED wafer was then analyzed for optical transmittance before and after annealing. LED devices were finally fabricated from the wafer, and the resultant overall power efficiencies of the fabricated LED devices were evaluated as a function of Ni and Au thickness.
机译:虽然过去十年氮化镓(GaN)发光二极管(LED)的效率提高,但是在优化P型GaN金属触点的镍 - 金组合物的优化方面具有进一步效率改善的巨大机会。这里描述的工作将分析LED P型触点的性能和性能,改变镍金(Ni-Au)组合物。在这项工作中,在Ni和Au的电子束沉积到LED晶片上,两个金属的相对厚度在空间上变化,以提供在单个LED晶片上的Ni和Au组合物的组合阵列。然后在退火之前和之后分析LED晶片上的每个Ni-Au组合物进行光学透射率。最终从晶片制造LED器件,并作为Ni和Au厚度的函数评估制造的LED器件的所得总功效。

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