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Development of Thickness and Diameter Measuring Device for Semi-conductor Application

机译:用于半导体应用的厚度和直径测量装置的研制

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摘要

The development of measuring device for thickness and diameter of dicing blade by using precise capacitance probe and laser beam sensor, not reported previously, is highlighted in this paper. The performances of developed measuring system provide with a repeatable accuracy of +/-1.0 micron meter for the thickness and. +/-0.5 micron meter for the diameter measurement. The measuring velocity of system can measure about one hundred dicing blades per one hour.
机译:本文突出了通过使用精确的电容探头和激光束传感器,通过使用精确的电容探头和激光束传感器的厚度和直径的测量装置的开发。开发测量系统的性能提供了可重复精度为+/- 1.0微米表的厚度和。 +/- 0.5微米表,用于直径测量。系统的测量速度可以测量每一个小时约一百个切割刀片。

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