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InGaN/GaN microwave varactors with high Q, high-breakdown voltage and high linearity

机译:IngaN / GaN微波变容器高Q,高击穿电压和高线性度

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Semiconductor varactors are receiving increasing attention because of their potential to provide adaptive and tunable characteristics for the front-end of wireless communication systems, enabling efficient multi-band and software-defined radios. For base-station applications, Q > 100, breakdown voltage > 100 V and OIP3 > 65 dBm are required. The combination of high Q and high-breakdown voltage requires semiconductors with high mobility and high-breakdown electric field [1]; GaN with a mobility of >∼ 500 cm2/Vsec and a breakdown electric field of 2.5 MV/cm is a promising candidate. SiC-based varactors have also been recently reported [2]. We have previously demonstrated GaN large-area varactors that achieve high-breakdown voltage. The addition of a thin InGaN surface layer was shown to increase the diode breakdown voltage and reduce the leakage current under high reverse bias [3]. In this work, InGaN/GaN Schottky-diode microwave varactors with Q > 100 at 1 GHz, breakdown voltage > 120 V and OIP3 > 71 dBm are reported. To the best of our knowledge, the combination of Q, voltage handling capability and OIP3 represents advancement from any other reported varactors.
机译:半导体变容仪由于它们提供了为无线通信系统的前端提供自适应和可调特性的潜力来接受越来越长的关注,从而实现有效的多频带和软件定义的无线电。对于基站应用,Q> 100,击穿电压> 100 V和OIP3> 65 dBm是必需的。高Q和高击穿电压的组合需要具有高迁移率和高击穿电场的半导体[1]; GaN的移动性>〜500cm 2 / vsec和2.5 mv / cm的击穿电场是一个有前途的候选者。最近报道了基于SIC的变容患者[2]。我们之前已经展示过达到高击穿电压的GaN大区域变容仪。显示添加薄的IngaN表面层以增加二极管击穿电压,并在高反向偏压下降低漏电流[3]。在这项工作中,报道了IngaN / GaN Schottky-二极管微波变容仪,Q> 100处为1 GHz,击穿电压> 120V和OIP3> 71dBm。据我们所知,Q,电压处理能力和OIP3的组合表示来自任何其他报告的变容仪的进步。

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