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Advanced automotive silicon systems

机译:先进的汽车硅系统

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The objective of this paper is to discuss latest developments in the semiconductor technology industry which lead to state-of-the-art automotive electronic systems. Automotive systems are becoming increasingly complex as throughput requirements for electronic control units (ECUs) increase and a number of networks are being implemented to share data between ECUs. The motivation behind this explosion of electronics will be discussed along with the challenges which are faced in realizing solutions. Advanced "system-on-a-chip" semiconductors are being developed as an enabling technology to facilitate such systems. This paper will discuss the most significant requirements of such automotive systems and the types of semiconductor technologies which are to be provided as leading edge solutions. In addition to breakthroughs in silicon integration and performance, associated technology requirements such as packaging and development tools are changing significantly. Progress in distributed embedded control is resulting in smart sensors and actuators which are physically scattered throughout the vehicle. Distributed vehicular electronics architectures will be discussed as well as the paradigm changes in electronics development.
机译:本文的目的是讨论半导体技术行业的最新发展,从而导致最先进的汽车电子系统。汽车系统变得越来越复杂,因为电子控制单元(ECU)的吞吐量需求增加,并且正在实现许多网络来共享ECU之间的数据。将讨论这种电子设备爆炸背后的动机以及实现解决方案所面临的挑战。先进的“芯片”半导体正在开发为能够提供技术,以便于这种系统。本文将讨论此类汽车系统的最重要要求以及将作为前缘解决方案提供的半导体技术的类型。除了在硅集成和性能方面的突破之外,包装和开发工具等相关技术要求也在发生显着变化。分布式嵌入式控制的进展导致智能传感器和致动器,它们在整个车辆中物理散射。将讨论分布式车辆电子架构以及电子发展的范式变化。

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