Reliability, thermal analysis and optimization wirability design of multi-layer PCB boards

摘要

This paper provides a comprehensive reliability and thermal analysis of a typical multi-layer printed wire board (PWB) wirability design. Based on some typical values of modem PWB design, numerical solutions are provided for the junction temperature, failure rate, reliability, electrical delay, and cost of typical PWBs. Then, an optimization wirability design procedure is provided by using a weighting method. The major design variable is the number of signal layers in PWB and criteria being considered are the cost, reliability and electrical performance. Monographs are provided for different design parameters.