The semiconductor industry requires high definition, highly legible markings on semiconductor parts which may be made of various materials. The prints must withstand solvents, solder flux, heat, and abrasion without becoming illegible. Gravure printing, the traditional approach, requires wet inks and printing plates and does not offer the flexibility of digital printing. Laser marking is increasingly used and offers digital printing advantages, but legibility of direct laser prints is poor because of lack of satisfactory contrast mechanisms.
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